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Home » SEMICON Europa 2021: Ushio to exhibit wide ranging semiconductor solutions

SEMICON Europa 2021: Ushio to exhibit wide ranging semiconductor solutions

Ushio brings solutions from EUV to IR for thermal processing, lithography, and surface treatment applications

Ushio Europe will present its superior range of semiconductor lighting solutions as co-habiting trade exhibitions, SEMICON Europa and Productronica, get underway at Messe München’s hall B1, booth B1818, from 16–19 November 2021. As a major international semiconductor industry conference and exhibition, SEMICON Europa, in particular, provides a huge networking opportunity for a variety of businesses. Ushio is particularly looking forward to presenting its top-of-the-line specialist industrial light source solutions for lithography, thermal processing, and surface treatment applications.

Ushio has prepared its full semiconductor product portfolio for the international visitors arriving in Munich. As a prominent manufacturer of industrial light sources, from extreme ultraviolet (EUV) to infrared (IR), Ushio’s Technical Development Team will be on hand to hold demonstrations and give technical advice.

Ushio to unveil several new products at SEMICON Europa 2021

At this year’s show, Ushio’s first in-person semiconductor industry event since the pandemic began; visitors will be treated to the European launch of several new Ushio products. Among Ushio’s latest innovations are a new line of LED heating modules, Direct Imaging systems, the UX4 full-field projection mask aligner exposure system, and LPP technology – the most versatile and compact EUV laser-produced plasma source on the market. Some familiar products are on offer too, with the Ushio experts preparing to offer answers to your queries on super-high pressure (SH) lamps, solid state lighting solutions (LEDs & Laser Diodes), halogen heating, UVE, and excimer technology.

New LED Heating Module

Ushio’s new LED heating modules are currently under development, but keeping to a theme of collaboration, the opinions and needs of potential customers are always at the front of the minds of Ushio engineers. Having already created a module that allows almost instantaneous heating in a fraction of a second, Ushio has mainly included features useful to customers interested in etching, deposition, and ion implantation. Those features have resulted in a compact, cost-effective LED heating module that boasts rapid and accurate temperature controls over the selected treatment area only.

Direct Imaging (DI) Systems

ADTEC Engineering, Ushio’s lithography subsidiary, is launching the DE-2 and DE-8 exposure systems at SEMICON Europa 2021. This allowed Ushio to add complete solutions for Direct Imaging (DI) Exposure for integrated circuit (IC) substrates and printed circuit board (PCB) processing to its portfolio. This also brings the partnership between ADTEC and Deca to the table, which will facilitate compatibility with Deca’s Adaptive Patterning™ technology.

Alongside Ushio’s large suite of steppers for MEMS, advanced packaging, and LCD manufacturing, ADTEC Engineering itself recently began expansion of its production site to keep up with growing demand from the lithography sector. Feel free to approach our colleagues at SEMICON Europa 2021, to discuss the options available to you for the DE-2 and DE-8 models.

Key Features: DE-2 Next Generation Direct-Write Exposure System

  • DE-2 W300 for 300 mm wafers; DE-2 P600 for 600 mm x 600 mm panels
  • Maskless Direct Imaging for fan-out WLP & PLP and high-precision packaging
  • Minimum Line/Space = 2/2 μm imaging capability
  • Overlay accuracy ≦ 1 μm
  • Optional: Deca’s Adaptive Patterning™ connectivity

UX-4: full-field projection mask aligner exposure system

Ushio presents its expertise in full-field projection exposure lithography tools, with the UX-4 Series Aligner improving production of micro-electromechanical systems (MEMS), powerful LEDs, and power devices.

Developed by the talented Japanese Ushio R&D team, UX-4 is equipped with a high quality lens for a large depth of field. Capable of full-field exposure of wafers up to 200 mm in diameter, UX-4 technology promotes a substantial improvement in productivity, while significantly reducing the cost of manufacture. With an optical irradiation system developed in-house, a high degree of homogeneity is ensured thanks to Ushio’s super high-pressure UV lamps (500 W ~ 35 kW). Designed in collaboration with device manufacturers, in response to their increasingly diverse needs, Ushio SH lamps are a highly-acclaimed tool in the litho-patterning industry.

Key Features: UX-4 Series Aligner

  • Mask Damage-free: No mask-wafer contact throughout the treatment process.
  • Full-Field Projection: Entire surface is treated in one shot, unlike other systems which require multiple shots due to their ‘stepper’ technique.
  • Three-Dimensional Exposure: Large depth of focus. High resolution treatment on both top and bottom of the step, unlike with proximity/contact aligners and steppers.
  • Thick-Film Resist Support: No mask-wafer sticking issues with thick-sticky resist. A problem long associated proximity and contact aligners.
  • Proximity Aligner Mask Diversion: No special mask is required, customised contact aligner masks can be used.

Intended Applications for UX-4 Full-Field Projection Aligner

  • Acceleration Sensors
  • BAW Filters
  • Crystal Oscillators
  • Diodes
  • IGBT
  • Inductors
  • Inkjet Heads
  • LEDs
  • MEMS
  • MMICs
  • MOS-FETs
  • Passive Components
  • Power Amps
  • Power Semiconductors
  • RF Devices
  • SAW filters
  • Sensors
  • Solar Cells
  • Thyristors
  • And many more…

LPP: the future is laser-produced plasma

After entering the field of laser-produced plasma (LPP), Ushio has created a versatile EUV light source. With this achievement, Ushio has announced a new product, which is currently under development, for lithography inspection and medical applications. Ushio’s LPP remains compact and easy to maintain.

Ushio's versatile laser-produced plasma (LPP) EUV light source is under development

The laser-produced plasma (LPP) EUV source is being developed at Ushio Germany, in cooperation with Fraunhofer ILT. The source utilises a rotating disc target coated with liquid tin and a solid-state nanosecond laser. The compact design has a potential to provide EUV photons to various applications. The source was designed to run at up to 50 kHz, with current tests running at 20 kHz; additionally, the designs feature a debris filter and collector so that focused EUV light is available at the intermediate focus point.

Key Features: Versatile LPP-EUV Light Source

  • Rotating liquid-tin covered disc target
  • Easy-operation
  • Small emission size: 100 x 45 μm2 (at plasma)
  • Stable output for hours/days
  • Tin spectrum (l: 13.5 nm)

The Usual Suspects: Ushio’s experts are ready to talk about their whole portfolio

Ushio has long been in the business of manufacturing lamps, modules, and full solutions for applications involved in lithography, thermal processing, and surface treatment. Aside from the new products mentioned above, Ushio will also be bringing along representatives who are knowledgeable on the following established products:

SH Lamps

  • Ushio is the world’s largest supplier of super-high pressure (SH) lamps and commands a global reputation for high-quality, cutting-edge technology.
  • Ushio is a named authorized brand of many top equipment manufacturers.

Solid State Lighting

  • From UV to IR, Ushio is well-known for its fully in-house LED and Laser Diode manufacturing division. With an extensive collection of standard and customisable products, including the leading Ushio Epitex LED brand, Ushio is able to meet the needs of even the most innovative and unexpected ideas.

Linear and Bent IR Lamps

Infrared Twin Tube Lamps

Excimer

  • Hyper V-ST: High-power compact excimer unit for surface activation and treatment. A compact, convenient, and cost-effective module with optional N2 purge.
  • 222 nm excimer lamps: Novel 222 nm exposure, which brings homogeneous irradiation without an optical system, enables higher wafer processing speeds (6” to 12”). Ushio’s instant on and off excimer di-electric barrier discharge lamps are mercury-free, and therefore, environmentally friendly.
  • Find out more about excimer on Ushio Europe’s Excimer: The Technology Explained page.

Contact Ushio: the Superior Light Solution Supplier for Semiconductor

As the world of face-to-face meetings is making a comeback, the Ushio team looks forward to seeing you at SEMICON Europa. If you can’t make it, but would like to find out how Ushio’s semiconductor industry light solutions can help your business, contact Ushio’s regional experts via the following links:

EMEA: https://www.ushio.eu/contact/
Asia: https://www.ushio.co.jp/en/inquiry_menu.html
United States: https://www.ushio.com/contact-us/

SEMICON Europa / Productronica
Messe München
Hall B1, Booth B1818
16–19 November 2021