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Semiconductor Wafer Cleaning

The presence of contaminants on the surface of semiconductor wafers can lead to cause them to be driven into the material during production, which can lead to an inferior product that has a diminished ability to perform as a good semiconductor. For this reason, the wafers must be prepared in a clean-room environment and undergo stringent wafer cleaning procedures before, during, and after production. While there are many ‘wet’ chemical-based wafer cleaning techniques, USHIO has developed some UV radiation-based solutions to speed up the process and cut costs during some of the procedures, by removing the need for some of the chemicals.

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