Peer-review paper published in the trade fair magazine JOINING PLASTICS (01/24)
Ushio gladly shares a peer-reviewed paper authored by the SKZ, which was featured in the most recent issue (01/2024) of the industry magazine JOINING PLASTICS. The study showcases the potential of adhesive-free joining of thermoplastics, utilizing Ushio’s VUV Excimer module ExciJet.
“This article presents a joining procedure which is based on using vacuum ultraviolet (VUV) radiation for the activation and modification of plastic surfaces. Thus, it is possible to achieve high bonding strengths at temperatures well below the material-specific softening range for welding without needing any additional materials such as adhesives. The influences of varying radiation doses on physical-chemical surface properties as well as on bonding strengths to the polymethyl methacrylate (PMMA), acrylonitrile butadiene styrene (ABS) and cycloolefin copolymer (COC) materials are investigated and discussed for this purpose. The integration of the VUV activation into a plastics joining process is demonstrated too.“ (Abstract from the SKZ research team)
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